Abstract
To understand the influence of oxygen vacancies in HfO2 on the electrical and reliability characteristics, we have investigated area-dependent leakage-current characteristics of HfO2 with large-area device and conducting atomic force microscopy (C-AFM). Unlike with the large-area analysis with typical capacitor and transistor, a clear evidence of oxygen vacancy was observed in nanoscale-area measurement using the C-AFM. Similar observations were made in various ostdeposition annealing ambients to investigate the generation and reduction of oxygen vacancy in HfO2. With optimized postdeposition annealing for oxygen vacancy, significantly reduced charge trapping was observed in HfO2 nMOSFET.
Original language | English |
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Pages (from-to) | 54-56 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 29 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2008 |
Keywords
- Charge trapping
- Conducting atomic force microscopy (C-AFM)
- Hafnium oxide
- Oxygen vacancy