Abstract
A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.
| Original language | English |
|---|---|
| Pages (from-to) | 8-13 |
| Number of pages | 6 |
| Journal | Macromolecular Research |
| Volume | 13 |
| Issue number | 1 |
| DOIs | |
| State | Published - Feb 2005 |
| Externally published | Yes |
Keywords
- Epoxy
- Mechanical properties
- Silicon
- Synthesis
- Thermal properties