Physicochemical and mechanical interfacial properties of trifluorometryl groups containing epoxy resin cured with amine

Soo Jin Park, Fan Long Jin, Jae Sup Shin

Research output: Contribution to journalArticlepeer-review

28 Scopus citations

Abstract

A phenyl-trifluoromethyl (-Ph-CF3) groups modified epoxy resin, diglycidylether of bisphenol A-fluorine (DGEBA-F), was synthesized and the physical properties, such as curing behaviors, thermal stabilities, and dielectric constant of the DGEBA-F/4,4′-diaminodiphenyl methane (DDM) system were investigated and compared with commercial DGEBA/DDM system. For the mechanical behaviors of the specimens, the fracture toughness and impact tests were performed, and their fractured surfaces were examined by using a scanning electron microscope (SEM). The dielectric constant values of the DGEBA-F/DDM system were lower than those of the DGEBA/DDM system and the mechanical properties of the casting DGEBA-F specimens were higher than those of the DGEBA specimens. This was probably due to the fact that the introduction of the -Ph-CF3 groups into the side chain of the epoxy resin resulted in improving the electrical properties and toughness of the cured DGEBA-F epoxy resin.

Original languageEnglish
Pages (from-to)240-245
Number of pages6
JournalMaterials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Volume390
Issue number1-2
DOIs
StatePublished - 15 Jan 2005
Externally publishedYes

Keywords

  • Activation energy
  • Dielectric properties
  • Fracture toughness
  • Synthesis
  • Thermal properties

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