Particle deposition on face-up flat plates in parallel airflow under the combined influences of thermophoresis and electrophoresis

The deposition velocity is used to assess the degree of particulate contamination of wafers or photomasks. A numerical model was developed to predict the deposition velocity under the combined influences of thermophoresis and electrophoresis. The deposition velocity onto a face-up flat plate in parallel airflow was simulated by varying the temperature difference between the plate's surface and ambient air or by changing the strength of the electric field established above the plate. Both attraction and repulsion by thermophoresis or electrophoresis were considered. When the plate's surface was colder than ambient air, the surface of the face-up plate could be at risk of contamination by charged particles even with a repulsive applied electric force. When the temperature of the plate's surface was higher than the ambient temperature, the degree of particulate contamination on the surface of the face-up plate could be remarkably reduced in the presence of an electric field. The effect of repulsive thermophoresis, however, is expected to be reduced for very fine particles of high electric mobility or for micrometer-sized particles with large gravitational settling speed when the charged particles are influenced by an attractive electric force.