TY - GEN
T1 - Paper speaker made with cellulose piezoelectric paper
AU - Kim, Heung Soo
AU - Kim, Jung Hwan
AU - Kim, Jaehwan
PY - 2008
Y1 - 2008
N2 - The fabrication process and characteristics of a piezoelectric paper made with cellulose are investigated in the present paper. Since cellulose has merits in terms of biodegradability, biocompatibility, abundance in nature, lightweight and cheap, piezoelectric paper can bring a broad technological impact in many areas, for example, sensors, actuators, speakers, microphones and microelectromechanical systems. Mechanical properties and piezoelectric charge constants of the fabricated piezoelectric paper showed large improvements compared with existing EAPap based on commercial cellophane. The improved characteristics of the piezoelectric paper provide the potential for acoustic applications. Some preliminary device demonstrations are presented.
AB - The fabrication process and characteristics of a piezoelectric paper made with cellulose are investigated in the present paper. Since cellulose has merits in terms of biodegradability, biocompatibility, abundance in nature, lightweight and cheap, piezoelectric paper can bring a broad technological impact in many areas, for example, sensors, actuators, speakers, microphones and microelectromechanical systems. Mechanical properties and piezoelectric charge constants of the fabricated piezoelectric paper showed large improvements compared with existing EAPap based on commercial cellophane. The improved characteristics of the piezoelectric paper provide the potential for acoustic applications. Some preliminary device demonstrations are presented.
KW - Cellulose
KW - Paper speaker
KW - Piezoelectricity
UR - http://www.scopus.com/inward/record.url?scp=84883419449&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84883419449
SN - 9781627481519
T3 - 15th International Congress on Sound and Vibration 2008, ICSV 2008
SP - 57
EP - 62
BT - 15th International Congress on Sound and Vibration 2008, ICSV 2008
T2 - 15th International Congress on Sound and Vibration 2008, ICSV 2008
Y2 - 6 July 2008 through 10 July 2008
ER -