Abstract
This letter examines the effect of oxygen (O2) highpressure annealing (HPA) on indium zinc oxide (IZO) thinfilm transistors (TFTs) with a high-quality Al2O3 passivation layer. The IZO TFTs anneal under an O2 atmosphere at 9 atm exhibits a high field-effect mobility, low subthreshold gate swing, moderate threshold voltage (V th), and high ION/OFF ratio of 30.4 cm 2/Vs, 0.10 V/decade, 0.79 V, and 108, respectively. In addition, the O2 HPA-treated IZO TFT has superior reliability (δVth= -0.5 V) to that of the 0.2-atm-annealed device (δVth= -3.7 V) under negative bias illumination stress conditions. This improvement can be attributed to the reduced concentration of oxygen vacancy defects in the IZO channel layer during the O2 HPA treatment.
Original language | English |
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Article number | 6522496 |
Pages (from-to) | 894-896 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 34 |
Issue number | 7 |
DOIs | |
State | Published - 2013 |
Keywords
- High mobility
- indium zinc oxide semiconductor
- oxygen vacancy
- photo-bias stability
- thin-film transistors (TFTs)