Fabrication of a 2.5 Gbps × 4 channel optical micro-module for O-PCB application

Hyun Shik Lee, Shinmo An, Young Kim, Do Kyoon Kim, Jin Ku Kang, Young Wan Choi, Seung Gol Lee, Beom Hoan O, El Hang Lee

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

We report on the fabrication of a polymer-based 2.5 Gbps × 4 channel optical interconnecting micro-module for optical printed circuit board (O-PCB) application. An optical waveguide array is used for optical transmission from vertical surface emitting laser (VCSEL) array to photodiode (PD) array and the built-in 45° waveguide mirrors are used for vertical coupling. The optical waveguide array and the 45° mirrors are fabricated by UV imprint process in one-step. We fabricate microlensed VCSELs by micro-inkjetting method, which reduced radiation angle of VCSEL from 18° to 15° for better light coupling. We use solder ball array and pin array for alignment between O-PCB and the electrical sub-boards with alignment mismatch below 10 μm in x, y and z axis. The fabricated optical interconnection module transmits data at the rate of 2.5 Gbps per channel.

Original languageEnglish
Pages (from-to)1347-1351
Number of pages5
JournalMicroelectronic Engineering
Volume83
Issue number4-9 SPEC. ISS.
DOIs
StatePublished - Apr 2006

Keywords

  • Micro-fabrication
  • Optical interconnection
  • Photonic integrated circuit
  • UV embossing

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