Electrochemical plating of Cu-Sn alloy in non-cyanide solution to substitute for Ni undercoating layer

Material Science

• Density 100%
• Plating 100%
• Electroplating 50%
• X-Ray Diffraction 50%
• Scanning Electron Microscopy 50%
• Cyclic Voltammetry 50%
• Energy-Dispersive X-Ray Spectroscopy 50%
• Rotating Disc Electrode 50%
• Electrodeposition 50%

Chemical Engineering

• Electrodeposition 100%
• Auxiliaries 50%
• Sulfuric Acid 50%