Effect of post heat-treatment on the microstructure and high-temperature oxidation behavior of precipitation hardened IN738LC superalloy fabricated by selective laser melting

Kyu Sik Kim, Sangsun Yang, Myeong Se Kim, Kee Ahn Lee

Research output: Contribution to journalArticlepeer-review

44 Scopus citations

Abstract

The present study investigated the effect of as-built and post heat-treated microstructures of IN738LC alloy fabricated via selective laser melting process on high temperature oxidation behavior. The as-built microstructure showed fine cell and columnar structure due to high cooling rate. Ti element segregation was observed in inter-cell/inter-columnar area. After post heat-treatment, the initially-observed cell structure disappeared, instead bimodal Ni3(Al, Ti) particles formed. High temperature (1273 K and 1373 K) oxidation test results showed parabolic oxidation curves regardless of temperature and initial microstructure. The as-built IN738LC fabricated via the selective laser melting process displayed oxidation resistance similar to or slightly better than that of IN738LC fabricated via wrought or cast process. Heat-treated SLM IN738LC, although had similar oxidation weight-gain values to those of the SLM as-built material at 1273 K, showed relatively better oxidation resistance at 1373 K. Bimodal Ni3(Al, Ti) precipitate formed in the post heat treatment changed the local chemical composition, thereby led to changes in alumina former/chromia former location and fraction on the alloy surface. It was concluded that in heat-treated IN738LC increased alumina former fraction was found, and this resulted in excellent oxidation resistance and relatively low weight-gain.

Original languageEnglish
Pages (from-to)95-103
Number of pages9
JournalJournal of Materials Science and Technology
Volume76
DOIs
StatePublished - 20 Jun 2021

Bibliographical note

Publisher Copyright:
© 2020

Keywords

  • High temperature oxidation
  • IN738LC
  • Oxidation mechanism
  • Post heat-treatment
  • Selective laser melting

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