A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor

Jang Hyun Kim; Hee Sauk Jhon; Dae Woong Kwon; Sihyun Kim; Byung Gook Park

doi:10.1109/SNW.2016.7578008

A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor

Jang Hyun Kim, Hee Sauk Jhon, Dae Woong Kwon, Sihyun Kim, Byung Gook Park

Seoul National University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

This paper presents tunnel field-effect transistors (TFETs) with a Through Silicon Via (TSV) integrated in a silicon on insulator (SOI) substrate. We suggest that the proposed device equipped with the TSV in a source possibly enhance the efficien1cy of heat removal. That is, the output characteristics of TFETs could be free of self-heating effect. Therefore, the technology, using TSV is expected to be a manufacturing method in that current source becomes uninfluenced with temperature.

Original language	English
Title of host publication	2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	112-113
Number of pages	2
ISBN (Electronic)	9781509007264
DOIs	https://doi.org/10.1109/SNW.2016.7578008
State	Published - 27 Sep 2016
Event	21st IEEE Silicon Nanoelectronics Workshop, SNW 2016 - Honolulu, United States Duration: 12 Jun 2016 → 13 Jun 2016

Publication series

Name	2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016

Conference

Conference	21st IEEE Silicon Nanoelectronics Workshop, SNW 2016
Country/Territory	United States
City	Honolulu
Period	12/06/16 → 13/06/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Access to Document

10.1109/SNW.2016.7578008

Cite this

Kim, J. H., Jhon, H. S., Kwon, D. W., Kim, S., & Park, B. G. (2016). A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor. In 2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016 (pp. 112-113). Article 7578008 (2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SNW.2016.7578008

@inproceedings{b554769c8ace4401b9c2009b91d38419,

title = "A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor",

abstract = "This paper presents tunnel field-effect transistors (TFETs) with a Through Silicon Via (TSV) integrated in a silicon on insulator (SOI) substrate. We suggest that the proposed device equipped with the TSV in a source possibly enhance the efficien1cy of heat removal. That is, the output characteristics of TFETs could be free of self-heating effect. Therefore, the technology, using TSV is expected to be a manufacturing method in that current source becomes uninfluenced with temperature.",

author = "Kim, {Jang Hyun} and Jhon, {Hee Sauk} and Kwon, {Dae Woong} and Sihyun Kim and Park, {Byung Gook}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 21st IEEE Silicon Nanoelectronics Workshop, SNW 2016 ; Conference date: 12-06-2016 Through 13-06-2016",

year = "2016",

month = sep,

day = "27",

doi = "10.1109/SNW.2016.7578008",

language = "English",

series = "2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "112--113",

booktitle = "2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016",

address = "United States",

}

Kim, JH, Jhon, HS, Kwon, DW, Kim, S & Park, BG 2016, A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor. in 2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016., 7578008, 2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016, Institute of Electrical and Electronics Engineers Inc., pp. 112-113, 21st IEEE Silicon Nanoelectronics Workshop, SNW 2016, Honolulu, United States, 12/06/16. https://doi.org/10.1109/SNW.2016.7578008

A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor. / Kim, Jang Hyun; Jhon, Hee Sauk; Kwon, Dae Woong et al.
2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 112-113 7578008 (2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor

AU - Kim, Jang Hyun

AU - Jhon, Hee Sauk

AU - Kwon, Dae Woong

AU - Kim, Sihyun

AU - Park, Byung Gook

PY - 2016/9/27

Y1 - 2016/9/27

N2 - This paper presents tunnel field-effect transistors (TFETs) with a Through Silicon Via (TSV) integrated in a silicon on insulator (SOI) substrate. We suggest that the proposed device equipped with the TSV in a source possibly enhance the efficien1cy of heat removal. That is, the output characteristics of TFETs could be free of self-heating effect. Therefore, the technology, using TSV is expected to be a manufacturing method in that current source becomes uninfluenced with temperature.

AB - This paper presents tunnel field-effect transistors (TFETs) with a Through Silicon Via (TSV) integrated in a silicon on insulator (SOI) substrate. We suggest that the proposed device equipped with the TSV in a source possibly enhance the efficien1cy of heat removal. That is, the output characteristics of TFETs could be free of self-heating effect. Therefore, the technology, using TSV is expected to be a manufacturing method in that current source becomes uninfluenced with temperature.

UR - http://www.scopus.com/inward/record.url?scp=84994753619&partnerID=8YFLogxK

U2 - 10.1109/SNW.2016.7578008

DO - 10.1109/SNW.2016.7578008

M3 - Conference contribution

AN - SCOPUS:84994753619

T3 - 2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016

SP - 112

EP - 113

BT - 2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 21st IEEE Silicon Nanoelectronics Workshop, SNW 2016

Y2 - 12 June 2016 through 13 June 2016

ER -

A Through Silicon Via for suppressing self-heating effect in tunnel field effect transistor

Abstract

Publication series

Conference

Bibliographical note

Access to Document

Other files and links

Fingerprint

Cite this