Abstract
In this paper, we present a receiver design that achieves high data rates while maintaining low power consumption for high bandwidth memory (HBM) applications, using 28-nm CMOS technology. The proposed receiver scheme incorporates an analog front-end with an active inductor and wide-range peaking control, effectively compensating for the significant losses from heavy capacitive loading in a multi-stack through-silicon-via (TSV) I/O channel at a low supply voltage of 0.7 V. Simulation results indicate that the receiver can process data at a rate of 11 Gb/s, consuming 1.15 mW of power in a 1 pF, 12-stacked HBM configuration. Additionally, the proposed receiver achieves an energy efficiency of 0.104 pJ/b/pF, demonstrating its potential for enhancing HBM system performance.
| Original language | English |
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| Title of host publication | Proceedings - International SoC Design Conference 2024, ISOCC 2024 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 47-48 |
| Number of pages | 2 |
| ISBN (Electronic) | 9798350377088 |
| DOIs | |
| State | Published - 2024 |
| Event | 21st International System-on-Chip Design Conference, ISOCC 2024 - Sapporo, Japan Duration: 19 Aug 2024 → 22 Aug 2024 |
Publication series
| Name | Proceedings - International SoC Design Conference 2024, ISOCC 2024 |
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Conference
| Conference | 21st International System-on-Chip Design Conference, ISOCC 2024 |
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| Country/Territory | Japan |
| City | Sapporo |
| Period | 19/08/24 → 22/08/24 |
Bibliographical note
Publisher Copyright:© 2024 IEEE.
Keywords
- HBM
- low-voltage supply
- Receiver
- swing-enhanced active inductor