A High-Speed HBM Receiver Design for High-Performance Computing Systems

Thinh Nguyen-Viet, Gyung Su Byun

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, we present a receiver design that achieves high data rates while maintaining low power consumption for high bandwidth memory (HBM) applications, using 28-nm CMOS technology. The proposed receiver scheme incorporates an analog front-end with an active inductor and wide-range peaking control, effectively compensating for the significant losses from heavy capacitive loading in a multi-stack through-silicon-via (TSV) I/O channel at a low supply voltage of 0.7 V. Simulation results indicate that the receiver can process data at a rate of 11 Gb/s, consuming 1.15 mW of power in a 1 pF, 12-stacked HBM configuration. Additionally, the proposed receiver achieves an energy efficiency of 0.104 pJ/b/pF, demonstrating its potential for enhancing HBM system performance.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2024, ISOCC 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages47-48
Number of pages2
ISBN (Electronic)9798350377088
DOIs
StatePublished - 2024
Event21st International System-on-Chip Design Conference, ISOCC 2024 - Sapporo, Japan
Duration: 19 Aug 202422 Aug 2024

Publication series

NameProceedings - International SoC Design Conference 2024, ISOCC 2024

Conference

Conference21st International System-on-Chip Design Conference, ISOCC 2024
Country/TerritoryJapan
CitySapporo
Period19/08/2422/08/24

Bibliographical note

Publisher Copyright:
© 2024 IEEE.

Keywords

  • HBM
  • low-voltage supply
  • Receiver
  • swing-enhanced active inductor

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